Samsung Electronics; Signed a memorandum of understanding with Broadcom and plans to cooperate in areas such as memory chips, foundry services and advanced packaging by 2030, with a scale of up to US$200 billion
Samsung Electronics: Signed a memorandum of understanding with Broadcom and plans to cooperate in areas such as memory chips, foundry services and advanced packaging by 2030, with a scale of up to US$200 billion. It will cooperate with Broadcom to develop Broadcom's next-generation AI accelerator based on Samsung HBM technology. It will provide foundry processes and advanced packaging solutions below 2 nanometers.