Samsung and Broadcom sign $200 billion agreement to deepen cooperation in areas such as memory and foundry technology
Samsung Electronics said in a statement that it signed a memorandum of understanding with Broadcom, and the two parties will expand strategic cooperation in the fields of memory and wafer foundry technology. In the next five years to 2030, the scale of cooperation between the two parties in the memory and wafer foundry fields will exceed US$200 billion. In terms of memory, Samsung will support Broadcom’s next-generation AI accelerator. In terms of foundry, the focus of the cooperation between the two parties is that Samsung provides 2-nanometer and below process technology for Broadcom products, including wireless broadband communication solutions. The cooperation between the two parties is also expected to expand to advanced packaging technologies based on Samsung's 2nm process, including 2.3D and 2.5D integration technologies, to create higher-performance, more energy-efficient AI and network chips.