Samsung wins $200 billion deal to supply chips to Broadcom
Samsung Electronics has won a contract worth more than $200 billion to supply chips to Broadcom, as the two companies strive to gain a greater share of the artificial intelligence (AI) infrastructure market. Samsung Electronics said in a statement on Saturday that the five-year agreement will last until 2030 and focuses on providing Samsung's 2nm and below advanced process technology for Broadcom products. The agreement will deepen the strategic cooperation between the two companies in the fields of memory chips and wafer foundry technology. Facing increasingly fierce competition from rivals, Samsung and its Korean counterpart SK Hynix are accelerating their efforts to win AI chip orders globally. South Korea aims to double its memory chip production capacity within five years to ensure it has world-class manufacturing capabilities, putting it well ahead of other countries. Samsung said that in the field of memory chips, the cooperation between the two parties is expected to expand to advanced packaging technologies based on Samsung's 2-nanometer process, including 2.3D and 2.5D integration technologies, to create higher-performance, more energy-saving AI and network chips. South Korean President Lee Jae-myung is visiting Silicon Valley to attend the AI Summit. During this visit, a number of technology deals were announced, including cooperation between Nvidia and Korean companies Naver and SK Hynix.